www.centralsemi.com r2 (4-march 2010) package details d 2 pak case mechanical drawing mounting pad geometry (dimensions in mm) part marking: full part number lead code: reference individual device datasheet.
www.centralsemi.com r2 (4-march 2010) package details d 2 pak case tape dimensions and orientation (dimensions in mm) direction of unreeling devices are taped in accordance with electronic industries association standard eia-481-2-a tape width: 24mm reel labeling information each reel is labeled with the following information: central part number, customer part number, purchase order number, quantity, lot number, date code and ship date. ordering information ? for devices taped and reeled on 13 reels, add tr13 suffix to part number. ? all smds are available in small quantities for prototype and manual placement applications. packaging base 13 reel = 800 pcs. reel packing information reel size reels per box (maximum) parts per box (maximum) box dimensions shipping weight (max.) inch cm lb kg 13 3 7 14 2,400 5,600 11,200 15x4x15 15x15x9 15x15x18 38x10x38 38x38x23 38x38x46 12 28 55 6 13 25
material composition specification d 2 pak case device average mass . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1460 mg fluctuation margin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +/-10% www.centralsemi.com r2 (3-june 2011) component material material substance cas no. substance (%wt) (mg) (%wt) (mg) (ppm) active device doped si 0.44% 6.42 si 7440-21-3 0.44% 6.42 4,397 leadframe cu alloy 64.56% 943 cu 7440-50-8 64.52% 942 645,224 fe 7439-89-6 0.03% 0.5 342 die attach high temperature solder paste 1.13% 16.5 pb 7439-92-1 1.04% 15.25 10,446 sn 7440-31-5 0.06% 0.825 565 ag 7440-22-4 0.03% 0.412 282 encapsulation* emc 31.98% 467 silica 7631-86-9 21.75% 317.5 217,472 epoxy resin 29690-82-2 6.4% 93.4 63,974 phenol resin 9003-35-4 3.2% 46.67 31,967 sb 2 o 3 1309-64-4 0.32% 4.67 3,199 br 7726-95-6 0.32% 4.67 3,199 emc green 31.98% 467 silica (fused) 60676-86-0 24.62% 359.5 246,240 epoxy resin 29690-82-2 3.2% 46.73 32,008 phenol resin 9003-35-4 3.1% 45.28 31,015 carbon black 1333-86-4 0.1% 1.4 959 metal hydroxide 1309-42-8 0.96% 14.0 9,589 plating** tin/lead process 1.89% 27.6 sn 7440-31-5 1.7% 24.88 17,042 pb 7439-92-1 0.19% 2.76 1,890 matte tin 1.89% 27.6 sn 7440-31-5 1.89% 27.64 18,932 *emc green molding compound is halogen-free. **for lead free plating, add suffix ?lead free? to part number. for tin/lead plating, add suffix ?tin/lead? to part number. no suffix designation allows for the supply of either lead-free or tin/lead plated product depending on availability. disclaimer the information provided in this material composition data sheet is, to the best of our knowledge, correct. however, there is n o guarantee to completeness or accuracy, as some information is derived from data sources outside the company.
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